Products

Semiconductor

The production of semiconductor microchips is one of the most sophisticated and costly processes in modern technology. Starting from quartz sand as the basic raw material, factories must go through hundreds of highly automated and extremely precise steps to create a new-generation processor. The most common base material for chip manufacturing is silicon crystal disks, known as wafers.

As industry requirements become increasingly strict, wafers must achieve near-perfect quality: ultra‑thin, high mechanical strength, and surface flatness with deviations measured in just a few nanometers. These standards form the foundation for further shrinking device dimensions, increasing transistor density, and enabling more powerful yet energy‑efficient products—from smartphones and laptops to advanced industrial and automotive control systems.

ACCRETECH has become one of the key technology providers in the semiconductor value chain. The company develops advanced systems and equipment that enable wafer production to meet industry standards with exceptional precision. Beyond its role as an equipment manufacturer, ACCRETECH positions itself as a comprehensive technology partner, offering technical services and operational support on a global scale.

With a widespread global presence, along with sales and service networks across Southeast Asia and application–demonstration centers in Malaysia, Thailand, and Vietnam, ACCRETECH ensures that customers always receive optimal, timely, and professional support.

We are committed to continuing innovation to deliver long‑term value solutions, helping customers strengthen their competitive edge in the semiconductor industry—an industry that is shaping the future of every smart device.

Wafer Edge Grinding

The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important.

The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC. As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials.

Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process.

In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years. We make proposals that achieve the improvement of quality, CoO and yield with our machine.