Products

Semiconductor

The production of semiconductor microchips is one of the most sophisticated and costly processes in modern technology. Starting from quartz sand as the basic raw material, factories must go through hundreds of highly automated and extremely precise steps to create a new-generation processor. The most common base material for chip manufacturing is silicon crystal disks, known as wafers.

As industry requirements become increasingly strict, wafers must achieve near-perfect quality: ultra‑thin, high mechanical strength, and surface flatness with deviations measured in just a few nanometers. These standards form the foundation for further shrinking device dimensions, increasing transistor density, and enabling more powerful yet energy‑efficient products—from smartphones and laptops to advanced industrial and automotive control systems.

ACCRETECH has become one of the key technology providers in the semiconductor value chain. The company develops advanced systems and equipment that enable wafer production to meet industry standards with exceptional precision. Beyond its role as an equipment manufacturer, ACCRETECH positions itself as a comprehensive technology partner, offering technical services and operational support on a global scale.

With a widespread global presence, along with sales and service networks across Southeast Asia and application–demonstration centers in Malaysia, Thailand, and Vietnam, ACCRETECH ensures that customers always receive optimal, timely, and professional support.

We are committed to continuing innovation to deliver long‑term value solutions, helping customers strengthen their competitive edge in the semiconductor industry—an industry that is shaping the future of every smart device.

Wafer Dicing

The task of the Dicing Machines is to singulate whole wafers or strips into individual chips and units. Blade Dicers cut the wafers using either hub or hubless saw blades while Laser Dicers cut wafers using Laser instead of blade and is a completely dry process. Our semi and fully automatic ACCRETECH Dicers are able to process wafers from 150 mm, 200 mm to 300 mm diameter. It is also possible to configure Accretech Dicing Machines to saw molded strips into individual units. The AD2000T and AD3000T PLUS , with two opposite-facing spindles, are the smallest fully automatic Blade Dicers in the world, setting new standards with their small footprint and high-efficiency. In addition to user-friendliness, their excellent properties include high processing speed with a very compact construction. 

300mm
AD3000T Plus HC
Discover More
200mm
AD2000T - S
Discover More
300mm
SS30
Discover More
200mm
AD20T
Discover More
300mm
SS30 Plus
Discover More
300mm
PS300
Discover More