Products

Semiconductor

The production of semiconductor microchips is one of the most sophisticated and costly processes in modern technology. Starting from quartz sand as the basic raw material, factories must go through hundreds of highly automated and extremely precise steps to create a new-generation processor. The most common base material for chip manufacturing is silicon crystal disks, known as wafers.

As industry requirements become increasingly strict, wafers must achieve near-perfect quality: ultra‑thin, high mechanical strength, and surface flatness with deviations measured in just a few nanometers. These standards form the foundation for further shrinking device dimensions, increasing transistor density, and enabling more powerful yet energy‑efficient products—from smartphones and laptops to advanced industrial and automotive control systems.

ACCRETECH has become one of the key technology providers in the semiconductor value chain. The company develops advanced systems and equipment that enable wafer production to meet industry standards with exceptional precision. Beyond its role as an equipment manufacturer, ACCRETECH positions itself as a comprehensive technology partner, offering technical services and operational support on a global scale.

With a widespread global presence, along with sales and service networks across Southeast Asia and application–demonstration centers in Malaysia, Thailand, and Vietnam, ACCRETECH ensures that customers always receive optimal, timely, and professional support.

We are committed to continuing innovation to deliver long‑term value solutions, helping customers strengthen their competitive edge in the semiconductor industry—an industry that is shaping the future of every smart device.

Dicing Blades

Dicing blades are saw blades which are used in fully and semi-automatic blade dicing machines. The selection of the right kind of dicing blade is a prerequisite for good sawing quality. ACCRETECH precision dicing blades are available for a vast range of applications and wafer materials. Unique electroplating technology ensures even granulation distribution, and high stability. We also offer our customers dressing plates to further enhance their cutting quality. With Accretech synergy effect, we are able to provide a total solution to all our customer by providing not only the best blade but also the best machine to achieve the best quality possible!

300mm
Dressing plate
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300mm
Hard Metal Saw
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300mm
Resin bond blades
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300mm
Hub Blade
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300mm
Metal bond blade
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300mm
Nickel Bond Blade
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