Products

Semiconductor

The production of semiconductor microchips is one of the most sophisticated and costly processes in modern technology. Starting from quartz sand as the basic raw material, factories must go through hundreds of highly automated and extremely precise steps to create a new-generation processor. The most common base material for chip manufacturing is silicon crystal disks, known as wafers.

As industry requirements become increasingly strict, wafers must achieve near-perfect quality: ultra‑thin, high mechanical strength, and surface flatness with deviations measured in just a few nanometers. These standards form the foundation for further shrinking device dimensions, increasing transistor density, and enabling more powerful yet energy‑efficient products—from smartphones and laptops to advanced industrial and automotive control systems.

ACCRETECH has become one of the key technology providers in the semiconductor value chain. The company develops advanced systems and equipment that enable wafer production to meet industry standards with exceptional precision. Beyond its role as an equipment manufacturer, ACCRETECH positions itself as a comprehensive technology partner, offering technical services and operational support on a global scale.

With a widespread global presence, along with sales and service networks across Southeast Asia and application–demonstration centers in Malaysia, Thailand, and Vietnam, ACCRETECH ensures that customers always receive optimal, timely, and professional support.

We are committed to continuing innovation to deliver long‑term value solutions, helping customers strengthen their competitive edge in the semiconductor industry—an industry that is shaping the future of every smart device.

CMP

Chemical mechanical planarisation (CMP), often called chemical mechanical polishing, is a process of polishing to a thin layer level. CMP was originally developed for use with typical semiconductor materials but is also being increasingly used in manufacturing micro systems. CMP is essential for low-K materials and in the manufacture of sensitive wafers whose surface consists of two materials made from one material compound, for example. Due to the different hardnesses and electricity of both materials, purely mechanical processing in this case would lead to notches in the material transition areas. Available in 3 range, the CMP lineup offers enhance process capability at a reasonable initial cost via utilization of proven technology concepts and knowledge.